August 30, 2011
Electro-Spec Introduces Innovative Gold Plating Process with Significant Cost Savings
Franklin, IN, February 18, 2011 -- Electro-Spec, Inc., one of the leading specialty plating facilities in the United States, has developed a new and innovative way to apply gold plating in a precise and controlled manner. These new plating lines provide the ability to selectively gold plate pins and contacts, which will dramatically reduce the cost for gold plating by applying the deposit only where it matters most with regard to performance.
To date, most pins and contacts have always been gold plated over the entire surface area of the part. Our new Selective Plating Technology provides the ability to plate only the most critical areas of the part. The ability to precisely control the deposit will save a considerable amount of money by reducing the amount of gold used during the process, and it also has the potential to enhance part performance in terms of wear resistance, corrosion resistance, conductivity, and solderability.
“RF/Microwave Connector companies and fastener companies have the opportunity to significantly reduce the cost for gold plating parts by using our Selective Plating Technology, stated Jeff Smith, President of Electro-plate. “With the price of gold skyrocketing to all time highs, having the ability to control the deposit greatly reduces the amount of material needed to produce the parts.”
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(chemsolvintl.com)
